Under the Academy of Interdisciplinary Studies, the Dual Degree Program in Technology & Management (T&M-DDP) is designed to provide a world-class interdisciplinary education that emphasizes technological innovation and managerial leadership with an inclination towards a global perspective. T&M-DDP, the first of its kind in Hong Kong, offers high-caliber students an inspiring opportunity to gain two internationally-recognized degrees in five years: Bachelor of Engineering (BEng) or Bachelor of Science (BSc), and Bachelor of Business Administration (BBA).
T&M-DDP empowers students the skills to analyze issues from both technological and business viewpoints and to solve problems with both quantitative and qualitative methodologies. Students also develop awareness of different cultures and global perspectives and foster a willingness to serve. With double degrees in technology and management, our graduates have a wide variety of career advancement opportunities.
Curriculum
As a fully-integrated program, T&M-DDP offers a holistic curriculum where students study engineering/science and business courses every year. In addition to the major disciplines, students are exposed to courses in mathematics, entrepreneurship, social science and humanities, and business communications in English and Chinese which sharpen their analytical skills, critical thinking, and broaden their horizons. The program is challenging yet rewarding as it delivers exclusive opportunities for students to acquire broad and deep knowledge in technology and management.
BEng/BSc Options:
AND
BBA Options:
*These majors can be declared with an Extended Major in Artificial Intelligence
#These majors can be declared with an Extended Major in Digital Media and Creative Arts
^Subject to approval
Enrichment Activities & Signature Courses
Apart from overseas exchange and internship opportunities, T&M-DDP offers a series of unique TEMG courses to cultivate students’ innovative thinking, deepen their knowledge of technology and management, and develop their communication and interpersonal skills, equipping them to become tomorrow’s global leaders:
T&M International Business Plan Competition (TEMG4970): This is a popular international event co-organized with overseas partner institutions in different continents, such as the University of Illinois at Urbana-Champaign, University of Bayreuth, King Abdulla University of Science and Technology, and National University of Singapore, just to name a few. Participants work in multinational teams to develop creative applications and viable business plans for an emerging technology.
T&M Corporate Consulting Projects (TEMG4950) and T&M Prototyping and Research Projects (TEMG4940): Students solve real-world challenges faced by our corporate sponsors using advanced technology and business strategies in the format of consulting, desktop research or solution prototyping. Past corporate sponsors include Arup, Bayer Japan, Google, JPMorgan, UBS, P&G, HARMAN, IBM, and PCCW-HKT, among many others.
T&M Case Analysis and Product Innovation (TEMG3950)
This is a fundamental course to develop students’ structured problem-solving skills using MECE frameworks, and communication skills using 5-Step Persuasive Selling in essay and presentation format. Also, it helps foster critical thinking using techniques such as Design Thinking, Value Proposition Design, and Business Model Canvas.
T&M Professional Activities (TEMG1010)
Throughout the 5-year program, a variety of Technology & Management enrichment activities e.g. Survival Camp, Executive Forum, career workshops, are offered to enhance students’ presentation and communication skills, develop their cross-cultural understanding, and cultivate their leadership abilities. These professional activities are customized for each class to meet the specific needs of students at different development stages.
Remarks:
Interview is compulsory for admission.
Dynamic and forward-looking, T&M-DDP graduates can handle technological issues and understand business management.
Our graduates work in diverse industries. (as of Jan 2024):